The **ATS-12D-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-12D-87-C2-R0 | | **Heat Sink Type** | Straight Fin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 2.72°C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 12.7mm | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body (Thermal Dissipator) The core of the unit is made from **AL6063 aluminum**. Aluminum is chosen for its high thermal conductivity and lightweight properties. The "Straight Fin" design maximizes surface area, allowing heat to transfer from the electronic component (like a BGA or FPGA) into the surrounding air. #### B. Push-Pin Mounting System Instead of using adhesive tape, this model uses a mechanical **Push-Pin** system: * **Pins:** Brass components that go through pre-drilled holes in the PCB. * **Springs:** Provides consistent "downward pressure" (compression) to ensure maximum contact between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the unit comes with a **pre-applied Thermal Interface Material** (usually ATS-produced T766 or similar). This material fills microscopic air gaps between the processor and the heat sink to reduce thermal resistance. --- ### 3. Performance Metrics Thermal performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.72 | | 300 (1.5 m/s) | 1.45 | | 500 (2.5 m/s) | 1.13 | --- ### 4. Applications This part is typically used to cool: * **BGA (Ball Grid Array)** components. * **Processors/CPUs** in embedded systems. * **ASICs and FPGAs** in networking hardware. * **Power supplies** that require compact, high-efficiency cooling.