ATS-12D-90-C2-R0
AI

## Technical Overview: ATS-12D-90-C2-R0
The **ATS-12D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Type** | Top Mount Heat Sink |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance** | 6.36°C/W (@ 100 LFM) |
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### 2. Design and Engineering Features
* **Fin Configuration:** This model features a **Fine Pitch** design. The high density of aluminum fins maximizes the surface area, allowing for efficient heat transfer into the surrounding air.
* **The pushPIN™ System:** This proprietary attachment system provides a secure, vibration-resistant mount. It uses a flexible spring-loaded mechanism that ensures consistent pressure between the heat sink and the component for optimal thermal contact.
* **Material properties:** Being made of Aluminum, it offers a high strength-to-weight ratio and excellent thermal conductivity while remaining cost-effective compared to copper.
* **Blue Anodized Coating:** The finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer.
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### 3. Performance Metrics
Thermal performance is measured by **Thermal Resistance**. Lower values indicate better cooling performance.
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 6.36 |
| 200 (1.0 m/s) | 2.27 |
| 300 (1.5 m/s) | 1.43 |
| 400 (2.0 m/s) | 1.10 |
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### 4. Part Number Breakdown
The part number `ATS-12D-90-C2-R0` follows a specific naming convention:
* **ATS**: Advanced Thermal Solutions.
* **12**: Design variation or series identifier.
* **D**: Attachment style (pushPIN™).
* **90**: Specific fin pattern or height code.
* **C2**: Thermal Interface Material (TIM) type (typically indicates a pre-applied high-performance phase change material).
* **R0**: Revision or RoHS compliance status.
- ⤷
What is the hole pattern required on the PCB for the pushPIN attachment?
- ⤷ How does the C2 Thermal Interface Material compare to standard thermal paste?
- ⤷ Is there a copper-core version of this specific heat sink for higher heat loads?