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  • ATS-12D-90-C2-R0

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    ## Technical Overview: ATS-12D-90-C2-R0 The **ATS-12D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 6.36°C/W (@ 100 LFM) | --- ### 2. Design and Engineering Features * **Fin Configuration:** This model features a **Fine Pitch** design. The high density of aluminum fins maximizes the surface area, allowing for efficient heat transfer into the surrounding air. * **The pushPIN™ System:** This proprietary attachment system provides a secure, vibration-resistant mount. It uses a flexible spring-loaded mechanism that ensures consistent pressure between the heat sink and the component for optimal thermal contact. * **Material properties:** Being made of Aluminum, it offers a high strength-to-weight ratio and excellent thermal conductivity while remaining cost-effective compared to copper. * **Blue Anodized Coating:** The finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Performance Metrics Thermal performance is measured by **Thermal Resistance**. Lower values indicate better cooling performance. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.36 | | 200 (1.0 m/s) | 2.27 | | 300 (1.5 m/s) | 1.43 | | 400 (2.0 m/s) | 1.10 | --- ### 4. Part Number Breakdown The part number `ATS-12D-90-C2-R0` follows a specific naming convention: * **ATS**: Advanced Thermal Solutions. * **12**: Design variation or series identifier. * **D**: Attachment style (pushPIN™). * **90**: Specific fin pattern or height code. * **C2**: Thermal Interface Material (TIM) type (typically indicates a pre-applied high-performance phase change material). * **R0**: Revision or RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for the pushPIN attachment?
    • ⤷ How does the C2 Thermal Interface Material compare to standard thermal paste?
    • ⤷ Is there a copper-core version of this specific heat sink for higher heat loads?