The **ATS-12D-99-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ Heat Sink | | **Heat Sink Type** | Push-pin Heat Sink | | **Attachment Method** | Push-Pin (with springs) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 1.15°C/W (@ 100 LFM) | --- ## 2. Key Design Components ### A. Fin Geometry (Cross-Cut) The ATS-12D-99-C2-R0 features a **cross-cut** fin design. This provides several advantages over straight fins: - **Omnidirectional Airflow:** It can dissipate heat effectively regardless of which direction the fan is blowing. - **Turbulence:** The gaps between the pins increase air turbulence, which breaks up the boundary layer and improves heat transfer efficiency. ### B. Attachment Mechanism (Push-Pins) The "Push-Pin" system is designed for secure mounting on a PCB (Printed Circuit Board). - **Spring Loading:** It utilizes a pre-assembled brass or plastic push-pin with a compression spring. - **Interface:** This ensures consistent pressure (roughly 20-30 PSI) against the heat-generating component (CPU, GPU, or FPGA), maximizing the effectiveness of the Thermal Interface Material (TIM). ### C. Thermal Performance The "C2" in the part number indicates a specific thermal performance tier and material quality. - **Thermal Resistance:** As the airflow (LFM - Linear Feet per Minute) increases, the resistance drops significantly. - **Heat Dissipation:** It is rated for medium-to-high power density components. --- ## 3. Physical Footprint To integrate this into a PCB design, the following spacing is required: ```yaml Base_Size: 45mm x 45mm Height: 20mm Hole_Pattern: 38mm (center to center) Number_of_Pins: 2 ``` --- ## 4. Typical Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** cooling high-speed networking chips. 2. **Industrial PC:** dissipating heat from embedded processors. 3. **Power Supplies:** cooling MOSFETs or power ICs. 4. **Computing:** Secondary heat sinks for VRMs (Voltage Regulator Modules).