The **ATS-12F-01-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 17.92°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Pattern** | Straight Fin | --- ### Key Component Features #### 1. Push-Pin Mounting System This part utilizes a standardized push-pin mechanism. The pins are pre-assembled with springs to provide the precise compression force required for optimal thermal contact between the heat sink and the electronic chip. #### 2. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; the anodization increases surface emissivity and protects the aluminum from corrosion. #### 3. Thermal Interface Material (TIM) The "C3" in the part number typically signifies the type of thermal interface material pre-applied to the base of the heat sink. This ensures a low-resistance path for heat to travel from the component to the fins. #### 4. Aerodynamic Design The fin pitch and height (10mm) are optimized for low-profile environments where vertical space is limited but airflow is present. --- ### Application Use Cases * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Telecommunications:** Used on high-speed data processing chips in routers and switches. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators. ---