## Overview of ATS-12F-02-C2-R0 The **ATS-12F-02-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that require efficient heat dissipation in a compact form factor. --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 12.70mm | | **Fin Style** | Push-Pin (Straight Fin) | | **Thermal Resistance** | 1.83 °C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (with Compression Spring) | | **Orientation** | High Performance / Vertical or Horizontal Airflow | --- ### Key Components & Design Features The part consists of three primary electronic/mechanical sub-components that work together to manage thermal loads: #### 1. The Heat Sink Body * **Fin Geometry:** Uses a straight-fin design to maximize surface area contact with the air. * **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Anodization:** The blue anodized finish provides corrosion resistance and increases emissivity for better radiative heat transfer. #### 2. The Push-Pin Attachment * **Material:** Typically high-quality plastic or brass. * **Function:** This provides a secure mechanical connection to the PCB (Printed Circuit Board) without the need for adhesive tapes, ensuring a consistent and reliable fit. #### 3. The Compression Spring * **Function:** Provides the necessary downward pressure (clamping force) on the electronic component. * **Importance:** Proper pressure is critical to minimizing the **Thermal Interface Material (TIM)** thickness, which significantly reduces the thermal resistance between the chip and the heat sink. --- ### Application Usage This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling of networking switches and routers. * **Industrial PCs:** Compact computing modules where vertical space is limited. * **Embedded Systems:** High-processing modules that generate significant heat in localized areas. --- ### Thermal Performance Data * **At 100 LFM (Linear Feet per Minute):** ~4.33 °C/W * **At 200 LFM:** ~1.83 °C/W * **At 400 LFM:** ~1.20 °C/W