The **ATS-12F-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 100 LFM) | | **Pressure Drop** | 0.50 (at 200 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ## 2. Key Design Features ### Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that this unit comes pre-applied with **T766 thermal phase change material**. This eliminates the need for external thermal paste, ensuring a high-quality thermal bond between the chip and the heat sink. ### Fin Profile (XC) This model features a **Cross-Cut (XC)** fin design. Unlike straight-fin heat sinks, the XC design allows for multi-directional airflow, making it highly effective in systems where the direction of the cooling fan's exhaust might vary or be turbulent. ### Mounting Mechanism The **pushPIN™** system uses a brass component and a stainless steel spring. This provides: * **Constant Pressure:** Ensures the heat sink stays flat against the component. * **Secure Attachment:** More reliable than adhesive tapes in high-vibration environments. * **Ease of Install:** Can be installed into pre-drilled holes on the PCB. --- ## 3. Thermal Performance Metrics The effectiveness of the heat sink depends on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 15.85 | 5.57 | 3.32 | 2.52 | | **Thermal Resistance (Ducted)** | 3.12 | 2.05 | 1.68 | 1.46 | --- ### Application Note This specific heat sink is ideal for **small form factor (SFF)** electronics and high-density PCB layouts where vertical space is limited to 15mm, but high thermal dissipation is required.