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  • ATS-12F-124-C2-R0

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    The **ATS-12F-124-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*, part of their "maxiFLOW" series. --- ### 1. General Specifications This part is engineered to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-12F-124-C2-R0 | | **Product Category** | Heatsinks | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | XC-Cut (Cross-cut) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 50.00 mm * **Width:** 50.00 mm * **Height:** 25.00 mm * **Pin Pitch:** Approximately 1.14 mm (Internal fin spacing) --- ### 3. Thermal Performance Thermal resistance determines how efficiently the part moves heat away from the silicon. The lower the $^\circ \text{C/W}$ value, the better the cooling. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$ - Unducted) | | :--- | :--- | | 1.0 m/s (200 LFM) | 3.18 | | 2.0 m/s (400 LFM) | 1.81 | | 3.0 m/s (600 LFM) | 1.45 | --- ### 4. Key Design Features * **maxiFLOW™ Design:** The unique flared fin structure maximizes the surface area for convective heat transfer while minimizing pressure drop. * **pushPIN™ Attachment:** It uses a specialized mounting system consisting of a brass or plastic pin and a stainless steel spring. This ensures even pressure on the component to improve thermal interface performance. * **Thermal Interface Material (TIM):** This specific part number usually comes pre-applied with **T766**, a high-performance thermal phase-change material or grease, ensuring immediate "out-of-the-box" installation. * **Blue Anodized Finish:** The coating is not just aesthetic; it provides increased surface emissivity and protects the aluminum from environmental corrosion. --- ### 5. Part Number Breakdown The suffix code provides details on the specific configuration: * **124:** Refers to the specific fin geometry and size within the series. * **C2:** Indicates the material/thermal interface (usually implies a specific TIM type). * **R0:** Refers to the revision and RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷What are the advantages of pushPIN mounting over adhesive tapes?
    • ⤷ How do I calculate if this heatsink is sufficient for my 15W TDP processor?
    • ⤷ What are the alternative thermal interface materials for this heatsink?