The **ATS-12F-150-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by **Advanced Thermal Solutions (ATS)**. ### 1. General Specifications This part belongs to the **maxiFLOW™** series, which uses a unique flared fin design to maximize cooling performance in constrained spaces. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-12F-150-C2-R0 | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 4.82 °C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring there is no interference with surrounding components. | Dimension | Value | | :--- | :--- | | **Size / Dimension** | 45.00mm x 45.00mm | | **Height (Off Base)** | 25.00mm | | **Hole Spacing** | 38.00mm | | **Fin Style** | Flared Fin (maxiFLOW) | --- ### 3. Key Electronic Cooling Features * **pushPIN™ Attachment:** This system features a flexible, tool-free mechanism. It includes a brass or plastic pin with a stainless steel spring that provides the precise compression force required to ensure optimal contact between the heat sink and the chip. * **maxiFLOW™ Geometry:** The fins are not strictly vertical; they flare outward. This reduces "pressure drop" and increases the surface area exposed to airflow, which is ideal for high-density electronic assemblies. * **T766 Thermal Interface:** The part comes with a pre-applied phase-change material. This fills the microscopic air gaps between the component (CPU/GPU/FPGA) and the heat sink base, significantly improving heat transfer efficiency. * **Thermal Performance Data:** * **At 100 LFM (0.5 m/s):** 7.03 °C/W * **At 400 LFM (2.0 m/s):** 3.35 °C/W * **At 700 LFM (3.5 m/s):** 2.48 °C/W --- ### 4. Application Use Cases This specific heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where space is limited but heat output is high. 3. **Power Electronics:** Cooling MOSFETs or power modules.