The **ATS-12F-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | Series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for consistent pressure | | **Dimensions** | 45mm x 45mm x 12.7mm | (L x W x H) | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | Lower is better for heat dissipation | | **Airflow Design** | XC (Extra Coarse) | Designed for specific airflow directions | --- ## 2. Key Components & Features ### A. pushPIN™ Attachment System Unlike adhesive tapes which can fail over time, this part uses the **pushPIN™** system. It consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Ensure a precise, constant force is applied to the component, optimizing the interface between the heat sink and the chip. ### B. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied. * **Function:** Fills microscopic air gaps between the heat sink base and the electronic component. * **Benefit:** Reduces contact resistance and ensures maximum heat transfer. ### C. Fin Geometry (XC Design) The "XC" designation refers to the fin pattern. * **Pitch:** Optimized for "Extra Coarse" airflow. * **Compatibility:** Works best in systems with moderate-to-high airflow environments where air can pass through the fins easily without creating high back-pressure. --- ## 3. Physical Dimensions (mm) | Dimension | Value (mm) | | :--- | :--- | | **A (Length)** | 45.00 | | **B (Width)** | 45.00 | | **C (Height)** | 12.70 | | **E (Pitch)** | 38.00 | | **F (Pitch)** | 38.00 | --- ## 4. Application Use Cases * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs. * **Embedded Systems:** Ideal for low-profile industrial PC builds due to its 12.7mm height.