ATS-12F-185-C2-R0
AI

The **ATS-12F-185-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power modules.
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## 🛠️ Technical Specifications
The following table outlines the physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Attachment Type** | Push Pin (Plastic/Brass) |
| **Material** | Aluminum (Blue Anodized) |
| **Fin Style** | XC-CUT (Cross-Cut) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Thermal Resistance** | 2.50 °C/W (at 1.0 m/s airflow) |
| **Pressure Pitch** | 33mm (Hole-to-hole) |
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## 🔍 Key Features
### 1. pushPIN™ Attachment System
This part uses a specialized **Push Pin** mechanism. Unlike adhesive tapes or simple clips, push pins provide:
* **High Engagement Force:** Ensures consistent contact between the heat sink and the component.
* **Reliability:** Resistant to vibrations and thermal cycling.
* **Ease of Installation:** Pre-drilled holes in the PCB allow for quick snap-in mounting.
### 2. XC-CUT Fin Design
The "XC-CUT" indicates a **cross-cut straight fin** pattern.
* **Airflow Versatility:** This design allows for better performance in systems where airflow direction might not be perfectly linear.
* **Surface Area:** It maximizes the surface area to volume ratio, improving heat dissipation into the surrounding air.
### 3. Thermal Interface Material (TIM)
The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum base.
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## 🌡️ Performance Metrics
Thermal resistance is critical for choosing a heat sink. The performance of the ATS-12F-185-C2-R0 varies based on the velocity of the air passing through it:
* **Unducted Flow (1.0 m/s):** ~2.50 °C/W
* **Unducted Flow (2.0 m/s):** ~1.47 °C/W
* **Unducted Flow (3.0 m/s):** ~1.21 °C/W
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- ⤷
How do I determine if the 33mm hole pitch matches my PCB layout?
- ⤷ What are the advantages of blue anodized aluminum over standard aluminum?
- ⤷ Can this heat sink be used with a custom fan attachment?