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  • ATS-12F-185-C2-R0

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    The **ATS-12F-185-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power modules. --- ## 🛠️ Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | XC-CUT (Cross-Cut) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 2.50 °C/W (at 1.0 m/s airflow) | | **Pressure Pitch** | 33mm (Hole-to-hole) | --- ## 🔍 Key Features ### 1. pushPIN™ Attachment System This part uses a specialized **Push Pin** mechanism. Unlike adhesive tapes or simple clips, push pins provide: * **High Engagement Force:** Ensures consistent contact between the heat sink and the component. * **Reliability:** Resistant to vibrations and thermal cycling. * **Ease of Installation:** Pre-drilled holes in the PCB allow for quick snap-in mounting. ### 2. XC-CUT Fin Design The "XC-CUT" indicates a **cross-cut straight fin** pattern. * **Airflow Versatility:** This design allows for better performance in systems where airflow direction might not be perfectly linear. * **Surface Area:** It maximizes the surface area to volume ratio, improving heat dissipation into the surrounding air. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum base. --- ## 🌡️ Performance Metrics Thermal resistance is critical for choosing a heat sink. The performance of the ATS-12F-185-C2-R0 varies based on the velocity of the air passing through it: * **Unducted Flow (1.0 m/s):** ~2.50 °C/W * **Unducted Flow (2.0 m/s):** ~1.47 °C/W * **Unducted Flow (3.0 m/s):** ~1.21 °C/W ---
    ✨ Follow-up Questions
    • ⤷ How do I determine if the 33mm hole pitch matches my PCB layout?
    • ⤷ What are the advantages of blue anodized aluminum over standard aluminum?
    • ⤷ Can this heat sink be used with a custom fan attachment?