The **ATS-12F-186-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 🛠️ Technical Specifications This component belongs to the **maxiFLOW™** series, designed to provide low thermal resistance and maximum cooling efficiency for electronic components like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-12F-186-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Tapered Fin (maxiFLOW) | | **Thermal Resistance** | 2.80°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ## 🧩 Key Components & Features ### 1. The Heat Sink Body * **Material:** Extruded aluminum, which offers a balance between thermal conductivity and weight. * **Fin Design:** It uses a **tapered fin** design. This allows for high-velocity airflow to pass through the fins while maintaining a large surface area for heat dissipation. * **Coating:** Black Anodized finish increases emissivity and protects the aluminum from corrosion. ### 2. pushPIN™ Attachment System Instead of simple adhesive or clips, this model uses a **pushPIN™** mechanism: * **Spring-loaded bolts:** These ensure consistent pressure between the heat sink and the component. * **Reliability:** It prevents the heat sink from shifting during vibration or shipping. * **Installation:** Requires pre-drilled holes on the PCB (Printed Circuit Board). ### 3. Thermal Interface Material (TIM) * The **C2** in the part number indicates the specific TIM used: **T766**. * This is a pre-applied phase-change material or high-performance grease that fills microscopic air gaps between the chip and the heat sink base to ensure efficient heat transfer. --- ## 📉 Thermal Performance Data Thermal resistance measures the component's ability to dissipate heat. Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.80 | | 2.0 m/s (400 LFM) | 1.76 | | 3.0 m/s (600 LFM) | 1.43 | --- ### Application Note This specific part is often used in **Telecommunications**, **Networking**, and **Industrial Computing** where components are housed in enclosures with active airflow (fans).