The **ATS-12F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It is part of their "Blue Ice" or high-density fin series, typically used for cooling high-power semiconductors like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the core physical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Part Number** | ATS-12F-207-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 30.00mm | | **Fin Style** | Fine-Pitch (High Density) | | **Thermal Resistance** | ~1.56°C/W (at 200 LFM airflow) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment System This part utilizes a specialized mounting system consisting of a brass or plastic pin and a stainless steel spring. * **Benefits:** Ensures even pressure across the component (TIM - Thermal Interface Material), preventing damage to the chip while maximizing heat transfer. * **Reliability:** Meets industry-standard vibration and shock requirements. ### B. Fin Geometry The "F" in the part number denotes a **Fine-Pitch** design. * High-density fins increase the total surface area without increasing the footprint of the heat sink. * This design is optimized for environments with consistent airflow (forced convection). ### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease, reducing assembly time and ensuring optimal thermal contact. --- ## 3. Application Use Cases This specific heat sink is categorized as a "Large Format" thermal solution, generally used for: 1. **Telecommunications:** High-speed routers and switch fabric chips. 2. **Power Electronics:** Large MOSFET arrays or IGBT modules. 3. **Computing:** Server-grade processors or embedded computing boards where vertical clearance allows for a 30mm height. --- ## 4. Understanding the Part Number Suffixes * **-C2:** Refers to the thermal performance tier and the pre-applied thermal interface material. * **-R0:** Indicates the revision status (Lead-Free / RoHS compliant).