The **ATS-12F-27-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height (Fin Depth)** | 12.70 mm | | **Attachment Type** | pushPIN™ | | **Pitch / Pattern** | 63.00 mm x 63.00 mm | | **Thermal Resistance** | 12.24°C/W (Unducted @ 100 LFM) | --- ### 2. Component Breakdown #### A. Fin Design (Cross-Cut) The ATS-12F-27-C2-R0 utilizes a **Cross-Cut** fin pattern. This design allows for: * **Multidirectional Airflow:** Unlike straight-fin heat sinks, cross-cut fins can receive airflow from multiple directions, making them ideal for systems with complex internal air currents. * **Increased Surface Area:** Maximizes the contact between the aluminum and the air to dissipate heat faster. #### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism rather than thermal adhesive. It includes: * **Pre-assembled Springs:** Ensures precise "Force-to-Board" pressure to maximize thermal interface material (TIM) performance. * **Compression Springs:** These prevent the heat sink from shifting during vibration or mechanical shock. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes (typically 3mm) on the PCB. #### C. Material and Finish * **AL6063 Aluminum:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emissivity. --- ### 3. Part Number Nomenclature (Decoding) To understand variations of this part, here is how the code is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **12** | Attachment Style / Series | | **F** | Fin Pitch (F = Fine) | | **27** | Specific Design Profile | | **C2** | Thermal Interface Material (C2 = T766 Phase Change) | | **R0** | RoHS Compliant / Revision Level | --- ### 4. Application Use Case This heat sink is generally used for **low-profile applications** where vertical space is limited (only 12.7mm high) but the surface area of the chip is large (70x70mm). It is commonly found in: * Network switches and routers. * Telecommunications equipment. * Industrial embedded computing.