The **ATS-12F-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 57.9mm x 36.8mm x 6mm | | **Attachment Method** | Push-Pin (Steel) | | **Thermal Resistance** | 25.25°C/W (Unducted) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part number can be broken down to understand its specific electronic design features: * **Finned Design:** It features a **Straight-Fin** configuration. This is ideal for systems with a steady, directed airflow (ducted or fan-driven), as it allows air to pass through the channels with minimal pressure drop. * **pushPIN™ Attachment:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This ensures a consistent pressure (compression) against the electronic component, which optimizes thermal transfer. * **Low Profile:** With a height of only **6mm**, it is designed for space-constrained electronic assemblies, such as 1U servers or thin embedded systems. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from corrosion. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 25.25 | | 200 (1.0 m/s) | 11.41 | | 300 (1.5 m/s) | 6.67 | | 400 (2.0 m/s) | 4.78 | --- ### 4. Application Use Cases 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulator Modules (VRMs). 3. **Embedded Systems:** Used in industrial PCs where vertical space is limited.