Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-12F-35-C3-R0

  • AI
    The **ATS-12F-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation for high-power electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 35mm x 35mm x 9.5mm | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 4.42°C/W @ 200 LFM | | **Flow Pattern** | maxiFLOW (High Performance) | | **Interface Material** | T412 (Phase Change Material) | --- ### 2. Key Features and Design * **maxiFLOW™ Geometry:** The heat sink features a unique spread fin design that increases the surface area and encourages turbulent airflow. This results in superior thermal performance compared to standard square-cut heat sinks. * **Push-Pin Attachment:** It utilizes a 2-pin attachment mechanism with brass pins and plastic springs. This ensures a consistent and secure pressure against the electronic component (CPU, GPU, or FPGA), maximizing thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** It comes with **T412**, a high-efficiency thermal pad that fills microscopic air gaps between the chip and the heat sink base. * **Durability:** The blue anodized coating provides surface protection against corrosion and electrical insulation in high-density environments. --- ### 3. Applications This specific part is typically used in environments where space is limited but high heat dissipation is required: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Computing:** Industrial PC processors and FPGA modules. 3. **Automotive:** Electronic Control Units (ECUs) and ADAS systems. 4. **Power Supplies:** Heat dissipation for power transistors and VRMs. --- ### 4. Dimensional Diagram (Reference) ```text 35.00mm <-----------> +-----------+ ^ | | | | ( ) | | 35.00mm | | | | ( ) | v +-----------+ Height: 9.50mm ```
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods to Push-Pins for this heat sink?
    • ⤷ How does the 'LFM' airflow speed affect the thermal resistance rating?
    • ⤷ Can the T412 thermal material be replaced with standard thermal paste?