ATS-12F-35-C3-R0
AI

The **ATS-12F-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation for high-power electronic components.
### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Dimensions** | 35mm x 35mm x 9.5mm |
| **Attachment Method** | Push-Pin (2-Pin) |
| **Thermal Resistance** | 4.42°C/W @ 200 LFM |
| **Flow Pattern** | maxiFLOW (High Performance) |
| **Interface Material** | T412 (Phase Change Material) |
---
### 2. Key Features and Design
* **maxiFLOW™ Geometry:** The heat sink features a unique spread fin design that increases the surface area and encourages turbulent airflow. This results in superior thermal performance compared to standard square-cut heat sinks.
* **Push-Pin Attachment:** It utilizes a 2-pin attachment mechanism with brass pins and plastic springs. This ensures a consistent and secure pressure against the electronic component (CPU, GPU, or FPGA), maximizing thermal transfer.
* **Pre-Applied Thermal Interface Material (TIM):** It comes with **T412**, a high-efficiency thermal pad that fills microscopic air gaps between the chip and the heat sink base.
* **Durability:** The blue anodized coating provides surface protection against corrosion and electrical insulation in high-density environments.
---
### 3. Applications
This specific part is typically used in environments where space is limited but high heat dissipation is required:
1. **Telecommunications:** Cooling of high-speed network switches and routers.
2. **Embedded Computing:** Industrial PC processors and FPGA modules.
3. **Automotive:** Electronic Control Units (ECUs) and ADAS systems.
4. **Power Supplies:** Heat dissipation for power transistors and VRMs.
---
### 4. Dimensional Diagram (Reference)
```text
35.00mm
<----------->
+-----------+ ^
| | |
| ( ) | | 35.00mm
| | |
| ( ) | v
+-----------+
Height: 9.50mm
```
- ⤷
What are the alternative attachment methods to Push-Pins for this heat sink?
- ⤷ How does the 'LFM' airflow speed affect the thermal resistance rating?
- ⤷ Can the T412 thermal material be replaced with standard thermal paste?