The **ATS-12F-40-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-12F-40-C3-R0 | | **Attachment Method** | Push Pin (Spring Loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 1.47°C/W (at 200 LFM) | | **Flow Direction** | Vertical Fin (Straight Fin) | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity, which aids in radiant heat transfer. #### B. Attachment Mechanism: Push Pins Unlike adhesive-based heat sinks, the "12F" series uses a mechanical push-pin system. * **Reliability:** Provides constant pressure to the component, ensuring consistent contact with the Thermal Interface Material (TIM). * **Hardware:** It typically uses brass or plastic pins with stainless steel springs to provide the necessary downward force. #### C. Thermal Interface Material (TIM) The **C3** designation indicates that the heat sink comes pre-applied with **T412 thermal tape**. This simplifies the assembly process, as the technician does not need to apply separate thermal paste or grease. --- ### 3. Part Number Decoder Understanding the "ATS-12F-40-C3-R0" syntax helps in identifying its features: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **12F** | Product Family (Push-pin style heat sink) | | **40** | Footprint dimension (40mm) | | **C3** | Thermal Interface Material (T412 Tape) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 4. **FPGA/ASIC:** Providing a stable thermal environment for high-density logic gates.