The **ATS-12F-45-C3-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "maxiFLOW™" series. --- ## 1. Technical Specifications This component is designed to dissipate heat from surface-mount components, such as CPUs, GPUs, or high-power transistors. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Heat Sink Type** | Fin-style (Flared Fin) | | **Thermal Resistance** | ~2.50 °C/W (at 200 LFM) | --- ## 2. Key Physical Features The "12F-45-C3-R0" suffix codes provide specific details about the geometry and material of the part: * **Flared Fin Design:** The fins spread outwards at the top. This increases the surface area for heat dissipation while reducing air pressure drop, allowing for better airflow through the sink. * **Push-Pin Attachment:** It uses a spring-loaded pin mechanism (`pushPIN™`). This ensures consistent pressure between the heat sink and the electronic component (IC), improving thermal conductivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or grease to ensure no air gaps exist between the heat sink and the chip. --- ## 3. Dimensions Understanding the footprint is critical for PCB layout design: * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 15.00 mm * **Pitch (Hole-to-Hole):** 38.00 mm --- ## 4. Application Use Cases This part is commonly found in the following electronic systems: 1. **Network Switches/Routers:** Cooling high-speed processing ASICs. 2. **Embedded Systems:** For industrial computers that require passive or low-airflow cooling. 3. **Power Electronics:** Cooling MOSFETs or IGBTs in power conversion modules.