ATS-12F-50-C3-R0
AI

The **ATS-12F-50-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, within a computer or industrial chassis.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Base Dimensions** | 35.00mm x 35.00mm |
| **Height (Off Base)** | 15.00mm |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Interface Material** | T412 (Double-sided adhesive tape) |
| **Fin Style** | XCUT (Cross-cut) |
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## 2. Key Component Breakdown
### A. XCUT Fin Design
The "XCUT" geometry means the vertical fins have been cut horizontally. This allows for:
- **Omnidirectional Airflow:** Heat can be dissipated regardless of the direction the cooling fan is blowing.
- **Improved Turbulence:** It breaks up the air boundary layer, increasing heat transfer efficiency.
### B. Push-Pin Mounting
The unit uses a spring-loaded push-pin mechanism. This is critical because:
- It provides **consistent pressure** across the chip surface.
- It ensures a secure mechanical connection to the PCB via pre-drilled holes.
- The springs are designed to exert a specific force (measured in grams/mm) to prevent crushing the delicate silicon die.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T412**. This is a high-performance thermal tape that fills microscopic air gaps between the heatsink and the electronic component, ensuring maximum thermal conductivity.
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## 3. Thermal Performance Matrix
Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 19.21 |
| 400 (2.0 m/s) | 11.00 |
| 600 (3.0 m/s) | 8.33 |
| 800 (4.0 m/s) | 7.08 |
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## 4. Part Number Decoder
The part number follows a specific logic:
- **ATS**: Advanced Thermal Solutions.
- **12**: Series type.
- **F**: Fin pitch/density indicator.
- **50**: Unique size/geometry identifier.
- **C3**: Material and Finish code (Blue Anodized Aluminum).
- **R0**: Revision/Packaging code.
- ⤷
What are the PCB hole requirements for the push-pin mounting on this model?
- ⤷ How does the T412 thermal tape compare to phase-change materials?
- ⤷ Is there a copper version of this heatsink for higher heat dissipation?