The **ATS-12F-71-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Category** | Push-Pin Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin with Brass Springs | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Fin)** | 30.00 mm | | **Thermal Resistance** | 6.77 °C/W (at 1.0 m/s airflow) | | **Pressure Drop** | 0.11 in H2O | | **Fin Pattern** | Square-Cut (Cross-Cut) | --- ### Key Electronic & Physical Characteristics #### 1. Heat Dissipation Mechanism This heat sink uses a **cross-cut fin design**. Unlike straight fins, the square-cut pattern allows for multi-directional airflow. This is critical in electronics where the internal airflow from fans might not be perfectly linear, ensuring maximum heat transfer to the surrounding air. #### 2. Attachment System (Push-Pin) The "71" in the part number corresponds to a specific hole pattern for the **Push-Pin** mounting system. * **Benefits:** Provides consistent pressure on the component (e.g., a BGA chip) to ensure a high-quality thermal interface. * **Material:** The pins are usually plastic or brass, paired with stainless steel or brass springs to maintain tension without damaging the PCB. #### 3. Thermal Interface Material (TIM) The "C3" designation typically indicates the pre-applied thermal material. * **Phase Change Material:** It often comes with a high-performance thermal pad or grease pre-applied to the base, reducing the contact resistance between the heat sink and the electronic chip. #### 4. Blue Anodized Finish The surface is treated with a blue anodized coating. This is not just for aesthetics; anodizing increases the **surface emissivity**, which slightly improves heat dissipation through radiation and protects the aluminum from corrosion and electrical conductivity on the surface. --- ### Typical Applications * **BGA (Ball Grid Array) Cooling:** Used on high-speed processors. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Telecommunications:** Cooling chips in routers or switches where vertical space is available (30mm height).