ATS-12F-79-C3-R0
AI

The **ATS-12F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Below are the primary specifications:
| Feature | Description |
| :--- | :--- |
| **Series** | pushPIN™ Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 25mm x 25mm x 30mm |
| **Attachment Type** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 2.63°C/W (at 100 LFM) |
| **Flow Orientation** | Vertical or Horizontal (depending on fins) |
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## 2. Key Components & Features
### A. Fin Design (Heat Dissipation)
The "79" in the part number refers to a specific fin pattern. These fins increase the surface area of the aluminum, allowing air to carry away heat more efficiently. This specific model uses **straight fins** designed for versatile airflow.
### B. pushPIN™ Attachment
Unlike adhesive tapes, this model uses a mechanical mounting system:
* **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB.
* **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component for maximum thermal transfer.
### C. Thermal Interface Material (TIM)
The **C3** designation indicates that this part typically comes with a pre-applied high-performance Thermal Interface Material (often a phase-change material or thermal grease) on the base to fill microscopic air gaps.
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## 3. Applications
This part is commonly found in:
* **Networking Hardware:** Routers, switches, and small servers.
* **Embedded Systems:** Industrial PCs and IoT gateways.
* **Power Supplies:** Cooling voltage regulators or power MOSFETs.
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## 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **12:** Series Number
* **F:** Fin pitch/style
* **79:** Specific dimensions/design profile
* **C3:** Thermal Interface Material type
* **R0:** Revision code / RoHS compliant
- ⤷
What are the advantages of pushPIN mounting over adhesive thermal tape?
- ⤷ How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
- ⤷ Are there alternative fin designs available for more restricted airflow environments?