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  • ATS-12F-79-C3-R0

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    The **ATS-12F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications: | Feature | Description | | :--- | :--- | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 30mm | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.63°C/W (at 100 LFM) | | **Flow Orientation** | Vertical or Horizontal (depending on fins) | --- ## 2. Key Components & Features ### A. Fin Design (Heat Dissipation) The "79" in the part number refers to a specific fin pattern. These fins increase the surface area of the aluminum, allowing air to carry away heat more efficiently. This specific model uses **straight fins** designed for versatile airflow. ### B. pushPIN™ Attachment Unlike adhesive tapes, this model uses a mechanical mounting system: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component for maximum thermal transfer. ### C. Thermal Interface Material (TIM) The **C3** designation indicates that this part typically comes with a pre-applied high-performance Thermal Interface Material (often a phase-change material or thermal grease) on the base to fill microscopic air gaps. --- ## 3. Applications This part is commonly found in: * **Networking Hardware:** Routers, switches, and small servers. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ## 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **12:** Series Number * **F:** Fin pitch/style * **79:** Specific dimensions/design profile * **C3:** Thermal Interface Material type * **R0:** Revision code / RoHS compliant
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN mounting over adhesive thermal tape?
    • ⤷ How does the air flow rate (LFM) affect the thermal resistance of this heat sink?
    • ⤷ Are there alternative fin designs available for more restricted airflow environments?