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  • ATS-12F-80-C3-R0

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    The **ATS-12F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Off Base)** | 15.00mm | | **Thermal Resistance** | 19.22°C/W (at 100 LFM) | | **Flow Orientation** | Vertical Fin (Cross-cut) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's geometry and material properties: * **ATS-12**: Refers to the specific series/profile within the ATS pushPIN catalog. * **F**: Indicates a **Fine** pitch fin pattern for optimized surface area. * **80**: A proprietary code relating to the specific fin configuration and length. * **C3**: Indicates the **Thermal Interface Material (TIM)** and hardware. "C3" typically refers to a pre-applied high-performance thermal pad or grease. * **R0**: Refers to the revision and the **Blue Anodized** finish, which provides corrosion resistance and improved emissivity. --- ### 3. Key Electronic Functions 1. **Heat Dissipation:** Its primary role is to increase the effective surface area of a semiconductor, allowing the heat generated by the electronic part to be transferred to the surrounding air. 2. **Thermal Protection:** By maintaining a low junction temperature, it prevents **Thermal Throttling** or permanent damage to the integrated circuit (IC). 3. **Mechanical Stability:** The "Push-Pin" mechanism ensures a consistent downward force (pressure) on the chip, which is critical for maximizing the efficiency of the thermal interface material. --- ### 4. Implementation Example To use this part in a PCB design, the layout must include two mounting holes spaced to match the pins. ```c // Design Constraints for ATS-12F-80-C3-R0 PCB_Hole_Diameter = "3.0mm"; Mounting_Pitch = "35.0mm"; // Example pitch Max_Component_Height = "15.0mm"; ```
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over adhesive thermal tapes?
    • ⤷ How does the 'Fine Pitch' fin design affect airflow requirements?
    • ⤷ What is the recommended hole pattern on a PCB for this specific heat sink?