ATS-12F-80-C3-R0
AI

The **ATS-12F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs.
---
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions (L x W)** | 30.00mm x 30.00mm |
| **Height (Off Base)** | 15.00mm |
| **Thermal Resistance** | 19.22°C/W (at 100 LFM) |
| **Flow Orientation** | Vertical Fin (Cross-cut) |
---
### 2. Breakdown of the Part Number
The alphanumeric code provides specific details about the component's geometry and material properties:
* **ATS-12**: Refers to the specific series/profile within the ATS pushPIN catalog.
* **F**: Indicates a **Fine** pitch fin pattern for optimized surface area.
* **80**: A proprietary code relating to the specific fin configuration and length.
* **C3**: Indicates the **Thermal Interface Material (TIM)** and hardware. "C3" typically refers to a pre-applied high-performance thermal pad or grease.
* **R0**: Refers to the revision and the **Blue Anodized** finish, which provides corrosion resistance and improved emissivity.
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### 3. Key Electronic Functions
1. **Heat Dissipation:** Its primary role is to increase the effective surface area of a semiconductor, allowing the heat generated by the electronic part to be transferred to the surrounding air.
2. **Thermal Protection:** By maintaining a low junction temperature, it prevents **Thermal Throttling** or permanent damage to the integrated circuit (IC).
3. **Mechanical Stability:** The "Push-Pin" mechanism ensures a consistent downward force (pressure) on the chip, which is critical for maximizing the efficiency of the thermal interface material.
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### 4. Implementation Example
To use this part in a PCB design, the layout must include two mounting holes spaced to match the pins.
```c
// Design Constraints for ATS-12F-80-C3-R0
PCB_Hole_Diameter = "3.0mm";
Mounting_Pitch = "35.0mm"; // Example pitch
Max_Component_Height = "15.0mm";
```
- ⤷
What are the advantages of push-pin mounting over adhesive thermal tapes?
- ⤷ How does the 'Fine Pitch' fin design affect airflow requirements?
- ⤷ What is the recommended hole pattern on a PCB for this specific heat sink?