The **ATS-12F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Type** | Fine Pitch (Straight Fins) | | **Thermal Resistance** | 17.85°C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface (TIM)** | T412 (High Performance) | --- ### Key Components & Design Features #### 1. Push-Pin Attachment Mechanism The "12F" in the part number indicates a specific push-pin configuration. - **Spring Loading:** The push-pins use a precise spring-tension mechanism to provide constant pressure on the electronic chip, ensuring optimal thermal contact. - **Reliability:** Unlike adhesive tapes, mechanical push-pins offer a more secure and permanent mounting solution for high-vibration environments. #### 2. Fine-Pitch Fin Geometry The fins are designed to maximize surface area within a small 35mm footprint. - **Airflow Efficiency:** The straight-fin design is optimized for environments with forced air (fans). - **Pitch:** The spacing between fins is calculated to balance pressure drop and heat dissipation. #### 3. Material and Coating - **Aluminum (6063):** Selected for its excellent thermal conductivity and lightweight properties. - **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emissivity. #### 4. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a thermal pad or paste that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### Application Usage This part is typically found in: - **Telecommunications:** Routers, switches, and base stations. - **Embedded Systems:** Industrial PCs and automation controllers. - **Consumer Electronics:** High-end set-top boxes or power supplies.