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  • ATS-12F-91-C3-R0

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    The **ATS-12F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed to cool integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 40mm x 40mm | | **Height** | 10mm (Low Profile) | | **Thermal Resistance** | 22.00 °C/W (Unducted) | | **Airflow Direction** | Vertical/Finned | | **Thermal Interface Material** | T412 (Phase Change) | --- ### 2. Breakdown of the Model Number The part number can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **12:** Heat sink series / pushPIN™ type. * **F:** Fin style (Straight or Cross-cut). * **91:** Specific dimension/geometry code. * **C3:** Material/Color code (typically signifies Blue Anodized finish). * **R0:** Revision or packaging code. --- ### 3. Key Electronic Functions The ATS-12F-91-C3-R0 serves several critical roles in an electronic assembly: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET), allowing air to carry away heat more efficiently. * **Component Protection:** By maintaining a lower junction temperature, it prevents thermal throttling and extends the lifespan of the semiconductor. * **Mechanical Stability:** The `pushPIN™` mechanism uses a brass attachment and a stainless steel spring to provide consistent pressure, ensuring the **Thermal Interface Material (TIM)** makes perfect contact with the chip. --- ### 4. Component Comparison (Airflow) Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.97 | | 300 (1.5 m/s) | 10.00 | | 500 (2.5 m/s) | 6.50 | | 700 (3.5 m/s) | 5.20 | ---
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole dimensions required for this heat sink?
    • ⤷ Is the T412 thermal interface material pre-applied to this part?
    • ⤷ How does 'Blue Anodized' finish affect thermal radiation compared to plain aluminum?