ATS-12F-91-C3-R0
AI

The **ATS-12F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed to cool integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
Below are the primary technical parameters for this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (Length x Width)** | 40mm x 40mm |
| **Height** | 10mm (Low Profile) |
| **Thermal Resistance** | 22.00 °C/W (Unducted) |
| **Airflow Direction** | Vertical/Finned |
| **Thermal Interface Material** | T412 (Phase Change) |
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### 2. Breakdown of the Model Number
The part number can be decoded as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **12:** Heat sink series / pushPIN™ type.
* **F:** Fin style (Straight or Cross-cut).
* **91:** Specific dimension/geometry code.
* **C3:** Material/Color code (typically signifies Blue Anodized finish).
* **R0:** Revision or packaging code.
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### 3. Key Electronic Functions
The ATS-12F-91-C3-R0 serves several critical roles in an electronic assembly:
* **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, FPGA, or Power MOSFET), allowing air to carry away heat more efficiently.
* **Component Protection:** By maintaining a lower junction temperature, it prevents thermal throttling and extends the lifespan of the semiconductor.
* **Mechanical Stability:** The `pushPIN™` mechanism uses a brass attachment and a stainless steel spring to provide consistent pressure, ensuring the **Thermal Interface Material (TIM)** makes perfect contact with the chip.
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### 4. Component Comparison (Airflow)
Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 21.97 |
| 300 (1.5 m/s) | 10.00 |
| 500 (2.5 m/s) | 6.50 |
| 700 (3.5 m/s) | 5.20 |
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- ⤷
What are the mounting hole dimensions required for this heat sink?
- ⤷ Is the T412 thermal interface material pre-applied to this part?
- ⤷ How does 'Blue Anodized' finish affect thermal radiation compared to plain aluminum?