The **ATS-12F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ HS Assembly | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features * **Fin Profile:** This model features **Straight Fins**. Straight fins are optimal for systems with a clear airflow path, providing a high surface area for heat exchange without significantly obstructing air movement. * **Attachment Mechanism (pushPIN™):** * It uses a spring-loaded push-pin mechanism. * This ensures a constant, high-pressure contact between the heat sink and the component, which is critical for efficient thermal transfer. * **Thermal Interface Material (TIM):** * It comes with **T766** pre-applied to the base. * This eliminates the need for manual thermal paste application and ensures uniform coverage. * **Material:** Made from **AL6063 aluminum**, which offers a balance between high thermal conductivity and structural lightweight properties. --- ### 3. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.48 | | 200 | 1.0 | 6.17 | | 400 | 2.0 | 3.46 | | 600 | 3.0 | 2.59 | --- ### 4. Application and Use Cases This specific heat sink is typically used in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Cooling of high-speed networking chips. * **Power Electronics:** Dissipating heat from Voltage Regulators or MOSFETs. ---