The **ATS-12G-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for high-power electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 6mm | | **Thermal Resistance** | 21.97°C/W (at 1.0 m/s airflow) | | **Spring Type** | Stainless Steel (Compression Spring) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Design Features * **maxiFLOW™ Geometry:** The fin structure features a high-aspect-ratio design that increases surface area while reducing pressure drop, making it ideal for systems with directed airflow. * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures even pressure across the component (like a CPU, FPGA, or GPU), optimizing thermal transfer. * **T766 Thermal Interface:** The part comes with pre-applied thermal grease/pad, ensuring that there is no air gap between the heat source and the aluminum base. ### 3. Application Use Cases This component is typically used in space-constrained environments where high power density is an issue: * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Base station hardware. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the fins: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 21.97 | | 400 | 2.0 | 12.01 | | 600 | 3.0 | 8.04 |