ATS-12H-182-C2-R0
AI

The part number **ATS-12H-182-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power ICs.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Attachment Method** | Push Pin (Spring-loaded) |
| **Thermal Resistance** | 7.51 °C/W (@ 100 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) |
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### 2. Part Number Breakdown
Understanding the nomenclature helps in identifying the exact variant:
* **ATS**: Manufacturer prefix.
* **12H**: Series designation (Push Pin type).
* **182**: Unique geometry identifier.
* **C2**: Color and Finish (C2 usually indicates Blue Anodized).
* **R0**: RoHS Compliance version / Revision.
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### 3. Key Electronic Functions
While a heat sink is a mechanical part, its role in an electronic circuit is critical for **Thermal Management**:
1. **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing air to carry away heat more efficiently.
2. **Reliability:** By maintaining the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents "thermal throttling" and extends the lifespan of the device.
3. **EMI Shielding:** In some configurations, grounded aluminum heat sinks can provide a minor degree of electromagnetic interference shielding.
4. **T766 Thermal Interface:** The "C2-R0" variant typically comes with a high-performance thermal pad or phase-change material pre-applied to ensure there are no air gaps between the heat sink and the chip.
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### 4. Implementation Details
* **Mounting:** Requires two specific holes on the PCB spaced according to the ATS push-pin pattern.
* **Airflow:** This is a "Straight Fin" design, meaning it is most effective when there is directional airflow (fan-cooled) moving through the channels.
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What are the PCB hole requirements for the ATS push-pin mounting system?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?