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  • ATS-12H-182-C2-R0

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    The part number **ATS-12H-182-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power ICs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push Pin (Spring-loaded) | | **Thermal Resistance** | 7.51 °C/W (@ 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the exact variant: * **ATS**: Manufacturer prefix. * **12H**: Series designation (Push Pin type). * **182**: Unique geometry identifier. * **C2**: Color and Finish (C2 usually indicates Blue Anodized). * **R0**: RoHS Compliance version / Revision. --- ### 3. Key Electronic Functions While a heat sink is a mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing air to carry away heat more efficiently. 2. **Reliability:** By maintaining the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents "thermal throttling" and extends the lifespan of the device. 3. **EMI Shielding:** In some configurations, grounded aluminum heat sinks can provide a minor degree of electromagnetic interference shielding. 4. **T766 Thermal Interface:** The "C2-R0" variant typically comes with a high-performance thermal pad or phase-change material pre-applied to ensure there are no air gaps between the heat sink and the chip. --- ### 4. Implementation Details * **Mounting:** Requires two specific holes on the PCB spaced according to the ATS push-pin pattern. * **Airflow:** This is a "Straight Fin" design, meaning it is most effective when there is directional airflow (fan-cooled) moving through the channels.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS push-pin mounting system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used for passive cooling without a fan?