ATS-12H-65-C2-R0
AI

The **ATS-12H-65-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Component Specifications
The following table outlines the physical and technical properties of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45.00mm x 45.00mm |
| **Height (Height Off Base)** | 25.00mm |
| **Pitch** | Fine-Pitch |
| **Thermal Resistance** | 1.42°C/W @ 100 LFM (Low Flow) |
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### 2. Key Features and Design
This heat sink is part of the **pushPIN™** line, which is designed for easy and secure attachment to Printed Circuit Boards (PCBs).
* **Heat Sink Pattern:** It features a **Straight-Fin** or **Cross-Cut** design (depending on the specific series configuration) optimized for vertical or horizontal airflow.
* **Attachment Mechanism:** It uses a brass push-pin with a stainless steel spring to provide consistent pressure on the processor, ensuring maximum heat transfer to the thermal interface material (TIM).
* **Thermal Interface Material (TIM):** The part typically comes with pre-applied **T766** phase-change material or similar high-performance grease to reduce air gaps between the chip and the aluminum.
* **Material Choice:** Aluminum is used for its lightweight properties and high thermal conductivity ($k \approx 205$ W/m·K).
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### 3. Part Number Breakdown (Nomenclature)
Understanding the code **ATS-12H-65-C2-R0**:
1. **ATS**: Advanced Thermal Solutions (Manufacturer).
2. **12**: Specific Series or Fin Designator.
3. **H**: High performance/specific height category.
4. **65**: Dimensions code (45mm x 45mm).
5. **C2**: Color and Finish (Blue Anodized).
6. **R0**: RoHS Compliant / Revision code.
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### 4. Implementation Use Cases
This heat sink is commonly found in:
* **Networking Equipment:** Routers, switches, and base stations.
* **Computing:** CPU/GPU cooling in embedded systems.
* **Industrial Controls:** High-power transistors and motor drivers that generate significant heat.
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What are the different push-pin options for this heat sink?
- ⤷ How do I calculate the thermal resistance needed for my specific IC?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes in terms of heat dissipation?