The **ATS-12H-72-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically to provide maximum surface area for cooling electronic components in constrained airflow environments. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 31.75mm | | **Thermal Resistance** | 2.51°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### 2. Key Component Features #### A. Design Geometry (maxiFLOW™) The "spread-fin" design is the most distinctive electronic part feature. Unlike standard straight-fin heat sinks, the fins on this model flare outward. This reduces pressure drop and increases the effectiveness of the airflow, making it ideal for cooling high-power BGA (Ball Grid Array) components. #### B. pushPIN™ Attachment Instead of using messy adhesives or simple tape, this unit uses a mechanical **pushPIN™** system. * **Benefits:** Ensures consistent pressure (clamping force) between the heat sink and the processor. * **Hardware:** Includes a brass pin and a stainless steel spring for durability. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a high-performance thermal pad that changes phase (softens) as it reaches operating temperature, filling microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Application Use Cases This specific part is typically found in: * **Networking Hardware:** Switches and routers. * **Telecommunications:** Base stations and data processing units. * **Industrial PCs:** Where high-heat CPUs or FPGAs require reliable mechanical mounting. --- ### 4. Thermal Performance Comparison The efficiency of this part varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.51 | | 400 | 2.0 | 1.64 | | 600 | 3.0 | 1.47 |