The **ATS-12H-91-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and design features. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-12H-91-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 21.97° C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | --- ### 2. Design and Construction The design of this heat sink is optimized for space-constrained environments where high airflow efficiency is required. * **Fin Style (Fine Pitch):** It utilizes a **straight fin** pattern, which provides a large surface area for heat dissipation relative to its low profile (10mm height). * **Material:** Made from high-grade aluminum for excellent thermal conductivity and lightweight properties. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material or similar, ensuring a high-quality thermal bond between the heat sink and the component. --- ### 3. PushPIN™ Attachment System One of the defining "electronic parts" of this assembly is the mechanical attachment system: * **Compression Springs:** Uses a precise force to ensure the heat sink remains in contact with the chip, even under vibration. * **Brass/Plastic Push Pins:** Designed to snap into pre-drilled holes on a PCB (Printed Circuit Board). * **Reliability:** This system eliminates the need for messy adhesives and allows for easy removal or replacement. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 12.13 °C/W | 21.97 °C/W | | 300 | 1.5 | 5.31 °C/W | 10.19 °C/W | | 500 | 2.5 | 3.59 °C/W | 6.87 °C/W |