The **ATS-13A-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW" product line, designed to optimize airflow and cooling for electronic components like BGAs and CPUs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13A-182-C2-R0 | | **Heat Sink Type** | maxiFLOW (T-Shape Fin) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.51°C/W (@ 100 LFM) | | **Fin Pattern** | Straight / Slanted (High airflow efficiency) | --- ### Core Electronic & Physical Components #### 1. Heat Sink Body (Thermal Conduction) The main body is made of **Aluminum**, chosen for its high thermal conductivity and light weight. The "C2" in the part number indicates a **Blue Anodized finish**, which increases surface emissivity and provides a layer of protection against corrosion. #### 2. Fin Design (Convection) The "maxiFLOW" geometry features a flared fin design. Unlike standard rectangular heat sinks, these fins are angled to: * Increase surface area for heat dissipation. * Reduce pressure drop (resistance to airflow). * Facilitate "cross-flow," allowing air to enter from multiple directions. #### 3. The pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a mechanical **pushPIN™** system: * **Springs:** Ensure constant, high pressure between the heat sink and the chip (e.g., a BGA package). * **Pins:** Brass or plastic pins that lock into pre-drilled holes on the PCB. * **TIM (Thermal Interface Material):** Usually comes with pre-applied Phase Change Material or grease to eliminate air gaps between the component and the heat sink. --- ### Performance Metrics Thermal performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.51 | | 300 (1.5 m/s) | 3.95 | | 500 (2.5 m/s) | 2.85 | ### Common Applications * **ASICs and FPGAs:** High-heat integrated circuits in networking gear. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Computing:** Industrial PCs where space is limited but thermal loads are high.