The **ATS-13A-75-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance (Unducted)** | 5.29 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | | **Fin Pitch** | Fine | --- ### 2. Part Number Breakdown The part number is structured to define every physical attribute of the heat sink: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Series/Attachment type (pushPIN™). * **A**: Fin design style. * **75**: Dimensions/Size code. * **C3**: Thermal Interface Material (TIM) type and specific mounting hardware configuration. * **R0**: Material and RoHS compliance status (standard aluminum). --- ### 3. Key Electronic Cooling Features #### High-Efficiency Fin Design The heat sink utilizes a **cross-cut** or **straight fin** design (depending on the specific sub-variant) optimized for low-pressure-drop environments. The 20mm height provides a large surface area for heat dissipation relative to its small 25mm footprint. #### PushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a spring-loaded pin system. * **Benefits:** Ensures constant pressure (Contact Pressure) for better thermal transfer. * **Security:** The "snap" engagement provides a secure mechanical lock to the PCB. * **Removability:** Allows for easy maintenance or replacement without damaging the board. #### Pre-applied Thermal Interface Material (TIM) The base comes pre-coated with **T412**, a high-performance thermal grease. This eliminates the need for manual application, reducing assembly time and ensuring a thin, uniform layer for maximum heat transfer from the chip to the aluminum. --- ### 4. Typical Applications This specific size (25x25mm) is commonly used in: * Networking equipment (Routers, Switches). * Embedded computing boards. * High-speed memory modules. * FPGA (Field Programmable Gate Array) cooling.