The **ATS-13B-03-C2-R0** is a high-performance thermal management component specifically designed for cooling electronic devices. It is part of the **Advanced Thermal Solutions (ATS)** "maxiFLOW" product line. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Heat Sink Type** | maxiFLOW (Tapered Fin Design) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 8.97°C/W (Unducted Flow @ 200 LFM) | | **Spring Type** | Stainless Steel (Compression Spring) | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### 2. Key Electronic & Mechanical Components The "Electronic Part" designation for this item refers to its assembly components that ensure effective heat dissipation from semiconductors: #### A. The Heat Sink (maxiFLOW™) * **Fin Geometry:** It uses a unique tapered fin design that increases the surface area for radiation and convection while reducing pressure drop. * **Material:** Extruded aluminum offers high thermal conductivity to pull heat away from the PCB component (CPU, GPU, or MOSFET). #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-13B-03-C2-R0** uses a mechanical push-pin system. This provides: * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Consistent Pressure:** The built-in springs ensure a specific amount of downward force, optimizing the contact between the sink and the chip. #### C. Thermal Interface Material (TIM) * The unit comes pre-applied with **T766**. * This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Common Applications This part is typically used in environments where space is limited but thermal loads are high: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-density power supplies.