The **ATS-13B-07-C2-R0** is a specific electronic component categorized as a **Heat Sink**, designed and manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" series and is engineered for high-performance cooling of integrated circuits (ICs) and other electronic chips. --- ### 1. Key Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 17.00°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Fin Pattern** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Details The ATS-13B-07-C2-R0 is designed with specific mechanical features to ensure efficient heat dissipation: * **Straight Fin Geometry:** This design allows for maximum airflow through the sink, which is ideal for systems with directed air cooling (fans). * **Aluminum Construction:** Offers a lightweight profile while maintaining high thermal conductivity. * **Anodized Finish:** The blue anodized coating increases surface emissivity and provides corrosion resistance. * **Push-Pin Attachment:** The "C2" designation typically refers to a specific push-pin and spring combination (often brass or plastic) that ensures even pressure across the chip surface for optimal heat transfer. --- ### 3. Part Number Breakdown Understanding the ATS naming convention helps identify the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **13B** | Series designation (Push-pin style) | | **07** | Internal dimension/fin configuration code | | **C2** | Attachment hardware type (Spring/Pin combo) | | **R0** | RoHS compliance and revision status | --- ### 4. Typical Applications This heat sink is commonly used in industrial and consumer electronics where space is limited but thermal loads are significant: * **Processors (CPUs/GPUs):** Small-form-factor logic chips. * **FPGA & ASICs:** High-speed programmable logic devices. * **Network Equipment:** Routers, switches, and modems. * **Power Supplies:** Cooling voltage regulators and power transistors.