The **ATS-13B-08-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "maxiFLOW™" series and is categorized as a high-performance **heat sink** designed for cooling integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized) | | **Dimensions (L x W x H)** | 48.26mm x 48.26mm x 22.86mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.59° C/W (Natural Convection) | | **Airflow Direction** | Horizontal (Spread Fin) | --- ### 2. Design and Component Breakdown This part is not an active electronic circuit but a **passive thermal management component**. Its design includes several key features: * **Fins:** It utilizes a "Spread Fin" design. Unlike standard rectangular fins, these flare outward to maximize surface area and increase airflow intake, reducing the temperature of the underlying chip more efficiently. * **pushPIN™ Attachment:** The "R0" suffix often refers to the specific attachment kit. This system uses a brass or plastic pin with a stainless steel spring to provide a precise, consistent pressure against the processor. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-performance thermal pad or phase-change material on the base to ensure there are no air gaps between the heat sink and the electronic component. --- ### 3. Electronic Applications The ATS-13B-08-C2-R0 is typically used in environments where heat dissipation is critical for the stability of sensitive electronics: 1. **Telecommunications:** Used on high-speed networking chips and routers. 2. **Embedded Systems:** Ideal for ARM or FPGA processors that generate significant heat in tight enclosures. 3. **Power Supplies:** Cooling MOSFETs or power conversion modules. --- ### 4. Part Number Decoding Understanding the nomenclature helps identify variations: * **ATS:** Advanced Thermal Solutions (Brand). * **13B:** Specific series/form factor identifier. * **08:** Designates the specific fin geometry and height. * **C2:** Refers to the thermal performance grade and material (Blue Anodized Aluminum). * **R0:** Indicates the attachment/kit version (Standard pushPIN).