The **ATS-13B-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series, commonly used for cooling ICs, BGAs, and other surface-mount components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Top Mount) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 14.61°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Design and Functional Features #### A. XCUT Fin Pattern The heatsink utilizes a **cross-cut (XCUT)** fin design. Unlike straight-fin heatsinks, cross-cut fins allow for: * **Omnidirectional Airflow:** Air can enter and exit the fin array from multiple angles, making it ideal for systems where the airflow direction is inconsistent or blocked by other components. * **Increased Surface Area:** The gaps between the pins increase the total surface area for heat dissipation. #### B. Push-Pin Attachment Mechanism This part uses a **Brass Push-Pin with a Stainless Steel Spring**. * **Function:** The pin passes through pre-drilled holes in the PCB. The spring provides consistent pressure (clamping force) on the high-power component. * **Reliability:** This is more secure than thermal adhesive tapes and allows for easy removal or rework. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only aesthetic but provides improved emissivity (radiant heat transfer) and corrosion resistance. --- ### 3. Application Use Cases This specific heatsink is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFET arrays or power management ICs. 4. **Processors:** Cooling Chipsets, FPGAs, or GPUs with a 45x45mm footprint. --- ### 4. Comparison to Similar Parts | Part Number | Height | Attachment | | :--- | :--- | :--- | | ATS-13B-07-C3-R0 | 12.7mm | Push-Pin | | **ATS-13B-08-C3-R0** | **15mm** | **Push-Pin** | | ATS-13B-09-C3-R0 | 20mm | Push-Pin |