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  • ATS-13B-10-C2-R0

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    The **ATS-13B-10-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** family of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-13B-10-C2-R0 | | **Heat Sink Type** | XCUT (Cross-cut) | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Plastic push pins with springs) | | **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Physical Design Features The component is engineered for optimal thermal management in cramped electronic environments: * **XCUT (Cross-Cut) Fin Design:** The fins are cut in both vertical and horizontal directions. This allows for multi-directional airflow, making the heat sink effective even if the air is not blowing directly in one straight line. * **pushPIN™ Mounting:** This system uses a spring-loaded mechanism to provide a consistent and specific amount of pressure (clamping force) on the chip. This ensures the best possible contact between the chip and the heat sink. * **Blue Anodized Coating:** The blue finish isn't just for aesthetics; anodization increases the surface area at a microscopic level and protects the aluminum from corrosion, while also slightly improving radiant heat transfer. --- ### 3. Electronic Application This part is typically used in the following scenarios: 1. **High-Heat Processors:** Cooling for FPGAs, GPUs, or high-speed CPUs on PCBs where space is limited. 2. **Telecom & Networking:** Used in routers and switches where constant airflow is present but multidirectional. 3. **Industrial Controls:** Applications requiring rugged mounting (push pins are more vibration-resistant than simple adhesive tapes). --- ### 4. Part Number Decoder (Breakdown) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **13** | Series/Product Family | | **B** | Material / Attachment Style | | **10** | Specific Fin Configuration/Height | | **C2** | Thermal Interface Material (T766) and Performance grade | | **R0** | RoHS Compliant / Revision Status |
    ✨ Follow-up Questions
    • ⤷ What is the difference between XCUT and straight fin heat sinks?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ What is the recommended hole diameter for the pushPIN mounting system?