ATS-13B-10-C2-R0
AI

The **ATS-13B-10-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** family of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-13B-10-C2-R0 |
| **Heat Sink Type** | XCUT (Cross-cut) |
| **Material** | Aluminum |
| **Attachment Method** | pushPIN™ (Plastic push pins with springs) |
| **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Physical Design Features
The component is engineered for optimal thermal management in cramped electronic environments:
* **XCUT (Cross-Cut) Fin Design:** The fins are cut in both vertical and horizontal directions. This allows for multi-directional airflow, making the heat sink effective even if the air is not blowing directly in one straight line.
* **pushPIN™ Mounting:** This system uses a spring-loaded mechanism to provide a consistent and specific amount of pressure (clamping force) on the chip. This ensures the best possible contact between the chip and the heat sink.
* **Blue Anodized Coating:** The blue finish isn't just for aesthetics; anodization increases the surface area at a microscopic level and protects the aluminum from corrosion, while also slightly improving radiant heat transfer.
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### 3. Electronic Application
This part is typically used in the following scenarios:
1. **High-Heat Processors:** Cooling for FPGAs, GPUs, or high-speed CPUs on PCBs where space is limited.
2. **Telecom & Networking:** Used in routers and switches where constant airflow is present but multidirectional.
3. **Industrial Controls:** Applications requiring rugged mounting (push pins are more vibration-resistant than simple adhesive tapes).
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### 4. Part Number Decoder (Breakdown)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **13** | Series/Product Family |
| **B** | Material / Attachment Style |
| **10** | Specific Fin Configuration/Height |
| **C2** | Thermal Interface Material (T766) and Performance grade |
| **R0** | RoHS Compliant / Revision Status |
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What is the difference between XCUT and straight fin heat sinks?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What is the recommended hole diameter for the pushPIN mounting system?