The **ATS-13B-102-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Straight (Mini-Fan) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.50° C/W (Unducted Flow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### pushPIN™ Attachment System This part utilizes a specialized mechanical attachment system. It uses a brass or plastic pin with a high-tension spring. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the electronic component for optimal heat transfer. * **Vibration Resistance:** Securely locks the heat sink to the PCB, preventing detachment during transit or high-vibration operation. ### Thermal Interface Material (TIM) The "C2" in the part number indicates the specific TIM used (T766). * **Function:** It fills microscopic air gaps between the heat sink base and the chip surface. * **Performance:** T766 is a high-performance phase-change material that offers low thermal impedance. ### Fine Pitch Fin Design The heat sink features a high-density fin arrangement designed for **forced air cooling**. In a chassis with active fans, the geometry maximizes surface area while minimizing pressure drop across the device. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in selecting variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **13B** | Product Series (pushPIN™ Heat Sink) | | **102** | Specific Size and Fin Geometry | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | ---