ATS-13B-121-C2-R0
AI

The **ATS-13B-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" series, designed for cooling integrated circuits (ICs) like processors, FPGAs, and ASICs.
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push Pin (with Springs) |
| **Dimensions** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 9.48°C/W (at 1.0 m/s flow) |
| **Fin Type** | Fine Pitch (Rectangular) |
| **Thermal Interface** | T766 (Phase Change Material) |
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### 2. Physical and Design Components
#### A. Fin Geometry (The "B" in the Part Number)
The "13B" indicates a specific fin pattern. These are usually **straight-cut or cross-cut fins** designed to maximize surface area within a low profile (10mm height). This allows it to fit in compact electronic enclosures where vertical space is limited.
#### B. Push Pin Attachment
Unlike adhesive-based heatsinks, this model uses a mechanical **push pin** system:
* **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a consistent and reliable downward force, which optimizes the contact between the component and the heatsink.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**, a high-performance thermal pad/phase change material. This fills the microscopic air gaps between the heatsink base and the chip, significantly improving heat transfer efficiency.
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### 3. Thermal Performance Analysis
The efficiency of this heatsink depends on the Airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| **200** | 1.0 | 9.48 |
| **400** | 2.0 | 5.04 |
| **600** | 3.0 | 4.01 |
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### 4. Part Number Breakdown
The code **ATS-13B-121-C2-R0** can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **13B:** Series and fin pattern.
* **121:** Dimensional code (45x45x10mm).
* **C2:** Blue Anodized finish.
* **R0:** Compliance/Version indicator (RoHS compliant).
- ⤷
What are the PCB hole requirements for the push-pin installation?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
- ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?