The **ATS-13B-15-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed primarily for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance (LFM 200)** | 7.44 °C/W | | **Thermal Resistance (LFM 800)** | 2.59 °C/W | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Breakdown of the Part Number The part number can be decoded to understand the exact configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13B**: Series/Style (typically refers to the fin profile and attachment type). * **15**: Specific size/dimensions identifier within that series. * **C2**: Indicates the material/finish (Aluminum with Blue Anodization). * **R0**: Version/Revision number. --- ### 3. Key Electronic Cooling Features * **maxiFLOW™ Design:** The heat sink features a tapered fin design that increases the surface area and encourages air turbulence, significantly improving heat dissipation compared to traditional straight-fin heat sinks. * **pushPIN™ Attachment:** This model uses a spring-loaded brass pin system. This provides a precise, reliable, and repeatable pressure on the component, ensuring optimal contact with the thermal interface material (TIM). * **Pre-Applied TIM:** It comes with **T766** thermal interface material pre-applied, which reduces assembly time and ensures a consistent thermal bond. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases the surface emissivity, which helps slightly with radiation cooling. --- ### 4. Typical Applications This component is used in environments where air cooling is the primary thermal management strategy: 1. **Telecommunications:** Networking switches and routers. 2. **Computing:** Embedded systems and industrial motherboards. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). ---