The **ATS-13B-150-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The part number provides specific data regarding its dimensions, thermal performance, and material properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 4.82 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Attachment Type** | Plastic Push Pins with Brass Springs | --- ### 2. Electronic/Thermal Performance The primary function of this part is to manage the thermal profile of electronic components. Its efficiency is measured by thermal resistance based on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 4.82 °C/W * **Medium Airflow (300 LFM):** 2.22 °C/W * **High Airflow (700 LFM):** 1.45 °C/W *Note: A lower °C/W value indicates better heat dissipation efficiency.* --- ### 3. Component Design Features * **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance thermal pad or grease (Phase Change Material), ensuring consistent heat transfer between the chip and the heat sink. * **Push-Pin Attachment:** This mechanical system provides a secure, vibration-resistant mount to the PCB. It uses a specific hole pattern to ensure even pressure across the die of the component. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### 4. Typical Applications This specific size (35mm x 35mm) is commonly used for: 1. **Network Switches:** Cooling ASICs and processors. 2. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs and automation controllers. 4. **FPGA Boards:** Providing thermal headroom for high-speed logic processing.