ATS-13B-152-C2-R0
AI

The **ATS-13B-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The following table outlines the key physical and thermal properties of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm |
| **Thermal Resistance** | 3.32°C/W (at 100 LFM) |
| **Fin Type** | Fine Pitch (straight fins) |
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### Key Electronic Components & Features
The part is comprised of three main sub-components that work together to manage electronic heat:
#### 1. The Heat Sink Body
Constructed from **6063-T5 aluminum**, the body features a high surface-area-to-volume ratio. The "Fine Pitch" fin design is optimized for airflow from system fans, allowing heat to transfer from the semiconductor package to the surrounding air.
#### 2. The Attachment Mechanism (pushPIN™)
Instead of using messy adhesives or complicated brackets, this part uses a standardized **push-pin** system.
* **Springs:** Provides consistent "Pre-load" pressure to ensure maximum contact between the chip and the heat sink.
* **Pins:** Usually made of nylon or brass, these snap into pre-drilled holes in the PCB (Printed Circuit Board).
#### 3. Thermal Interface Material (TIM)
The **"C2"** in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal grease.
* **Purpose:** Fills microscopic air gaps between the electronic component and the heat sink.
* **Conductivity:** High-performance thermal interface ensures efficient heat flow (high $W/m \cdot K$).
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### Deciphering the Part Number
| Code | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **13B** | Product Series (pushPIN™ Heat Sink) |
| **152** | Specific Dimensions / Configuration |
| **C2** | Thermal Interface Material (T766/T412 equivalent) |
| **R0** | RoHS Compliant (Lead-free) |
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### Application Usage
This part is typically found in:
* **Networking Equipment:** Routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
- ⤷
How do I calculate if the 3.32\u00b0C/W thermal resistance is sufficient for my specific chip?
- ⤷ What are the PCB hole diameter requirements for the push-pin mounting system?
- ⤷ Can this heat sink be used with a custom fan attachment?