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  • ATS-13B-152-C2-R0

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    The **ATS-13B-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the key physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | | **Fin Type** | Fine Pitch (straight fins) | --- ### Key Electronic Components & Features The part is comprised of three main sub-components that work together to manage electronic heat: #### 1. The Heat Sink Body Constructed from **6063-T5 aluminum**, the body features a high surface-area-to-volume ratio. The "Fine Pitch" fin design is optimized for airflow from system fans, allowing heat to transfer from the semiconductor package to the surrounding air. #### 2. The Attachment Mechanism (pushPIN™) Instead of using messy adhesives or complicated brackets, this part uses a standardized **push-pin** system. * **Springs:** Provides consistent "Pre-load" pressure to ensure maximum contact between the chip and the heat sink. * **Pins:** Usually made of nylon or brass, these snap into pre-drilled holes in the PCB (Printed Circuit Board). #### 3. Thermal Interface Material (TIM) The **"C2"** in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal grease. * **Purpose:** Fills microscopic air gaps between the electronic component and the heat sink. * **Conductivity:** High-performance thermal interface ensures efficient heat flow (high $W/m \cdot K$). --- ### Deciphering the Part Number | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **13B** | Product Series (pushPIN™ Heat Sink) | | **152** | Specific Dimensions / Configuration | | **C2** | Thermal Interface Material (T766/T412 equivalent) | | **R0** | RoHS Compliant (Lead-free) | --- ### Application Usage This part is typically found in: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
    ✨ Follow-up Questions
    • ⤷ How do I calculate if the 3.32\u00b0C/W thermal resistance is sufficient for my specific chip?
    • ⤷ What are the PCB hole diameter requirements for the push-pin mounting system?
    • ⤷ Can this heat sink be used with a custom fan attachment?