The **ATS-13B-154-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 19mm | | **Attachment Method** | pushPIN™ (Brass pins) | | **Spring Type** | Compression Springs | | **Thermal Resistance** | 7.51 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (High performance) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread fin structure. This increases the surface area exposed to airflow, which is critical for heat dissipation in crowded PCB (Printed Circuit Board) environments where airflow may be irregular. ### B. pushPIN™ Attachment System This specific model uses a **pushPIN™** system. For electronic engineers, this is advantageous because: * **Uniform Pressure:** It provides consistent pressure across the surface of the electronic chip, ensuring the Thermal Interface Material (TIM) works efficiently. * **Secure Fit:** It ensures the heat sink stays attached during physical shocks or vibrations. ### C. Thermal Interface Material (T766) The `-C2` in the part number indicates the presence of **T766 phase-change material**. * This material fills microscopic air gaps between the chip and the heat sink. * It improves heat transfer efficiency from the silicon die to the aluminum fins. --- ## 3. Physical Dimensions (Summary) The compact size is designed for standard high-density electronic boards. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 19.00 mm (Low profile for 1U/2U rack servers) --- ## 4. Part Number Breakdown ```text ATS - 13 B - 154 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface (T766) | | +-------------- Sequence Number (Specific design) | +-------------------- Attachment Type (pushPIN) +-------------------------- Advanced Thermal Solutions (Manufacturer) ```