The **ATS-13B-155-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "Blue" series, designed for push-pin mounting on integrated circuits (ICs). --- ### 1. Technical Specifications The part number encodes specific data regarding its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W @ 1.0 m/s (approx.) | | **Mounting Style** | Push-Pin (2-hole) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Features * **Fin Geometry:** This model utilizes a **straight fin** design. Straight fins are ideal for unidirectional airflow environments where the cooling fan blows air directly across the length of the fins. * **Attachment Mechanism:** It uses a **Push-Pin** system. This consists of a spring-loaded plastic or brass pin that snaps into pre-drilled holes on the Printed Circuit Board (PCB). * *Advantage:* Provides consistent pressure for optimal heat transfer without the risk of the heat sink shifting. * **Base Material:** Made from extruded aluminum, which provides a balance between lightweight construction and high thermal conductivity. --- ### 3. Thermal Performance Profile The efficiency of this heat sink depends on the velocity of the air (measured in Linear Feet per Minute - LFM or Meters per Second - m/s). | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Low Flow) | ~5.37 | | 2.0 (Standard) | ~3.66 | | 3.0 (High Flow) | ~2.99 | --- ### 4. Typical Applications This specific size and mounting style are commonly used for: 1. **BGA Packages:** High-speed processors or FPGAs. 2. **Network Switches:** Cooling internal ASICs. 3. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers. 4. **Industrial PCs:** Compact computing modules requiring passive or semi-passive cooling. ---