The **ATS-13B-16-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the thermal management category, specifically a high-performance **heat sink** designed for cooling integrated circuits (ICs) and other electronic chips. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13B-16-C2-R0 | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~18.08°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 10mm | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System The "R0" suffix indicates the use of the ATS pushPIN™ mounting system. This features: * **Precision Springs:** Provides the exact required pressure (load) to ensure optimal thermal interface contact. * **Tool-less Installation:** Designed for quick assembly onto a Printed Circuit Board (PCB) using pre-drilled holes. ### B. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a protective layer against corrosion and slightly increases emissivity for better radiant cooling. ### C. Fin Profile The **13B series** typically features a **Straight Fin** or **Cross-Cut** geometry. This design is optimized for "Open Air" or "High Velocity" environments where airflow is directed through the fins to carry heat away from the component. --- ## 3. Application Use Cases This part is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking chips and routers. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (10mm height). 3. **Power Electronics:** Managing heat for MOSFETs or voltage regulators in power supplies. --- ## 4. Thermal Performance Data *Measured in Degrees Celsius per Watt (°C/W)* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.08 | | 300 (1.5 m/s) | 8.32 | | 500 (2.5 m/s) | 5.94 |