The **ATS-13B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors and electronic packages. --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 12.30°C/W (Unducted @ 200 LFM) | | **TIM (Thermal Interface Material)** | T412 (High performance) | --- ### ### Core Electronic Roles #### 1. Heat Dissipation The primary electronic function of this part is to increase the surface area of an integrated circuit (IC), such as a **BGA (Ball Grid Array)** or **FPGA**, allowing heat to escape into the surrounding air more efficiently. #### 2. Thermal Interface Material (T412) The "C3" designation often refers to the specific TIM applied to the base. The **T412** material is a phase-change or high-conductivity pad that fills microscopic air gaps between the electronic chip and the metal heat sink, ensuring maximum heat transfer. #### 3. Mechanical Protection (pushPIN™) The **pushPIN™** assembly provides a precise, reliable attachment to the PCB (Printed Circuit Board). This ensures constant pressure on the electronic component, which prevents "air gaps" that lead to overheating while protecting the solder joints from mechanical stress. --- ### ### Component Structure 1. **High Aspect Ratio Fins**: The "maxiFLOW" design uses a tapered fin structure to maximize airflow and reduce the pressure drop, which is critical in densely packed electronic enclosures. 2. **Blue Anodized Finish**: Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat emissivity. 3. **Spring/Pin Assembly**: Uses a brass or plastic pin with a stainless steel spring to lock the heat sink into pre-drilled holes on the PCB. ---