The **ATS-13B-17-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed to provide superior thermal management for electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal characteristics of this component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 7.51°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.53°C/W @ 700 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design The heatsink utilizes a tapered fin design. This geometry maximizes the cooling surface area while minimizing the pressure drop. It is specifically engineered to handle high-velocity airflow environments found in servers and telecommunications equipment. #### B. pushPIN™ Attachment System Instead of simple adhesives, this part uses the **pushPIN™** system: * **Secure Fit:** Uses a spring-loaded mechanism to ensure constant pressure between the heatsink and the component. * **Standard Mounting:** Compatible with industry-standard hole patterns. * **Reliability:** Resistant to vibration and mechanical shock compared to "peel-and-stick" thermal tapes. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. T766 is a high-performance phase-change material that fills microscopic air gaps between the chip and the heatsink base, significantly improving heat transfer efficiency. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **13B** | series type (maxiFLOW with pushPIN) | | **17** | Specific product dimensions/configuration code | | **C2** | Performance class / Fin density variant | | **R0** | RoHS compliance status and packaging revision | --- ### 4. Application Use-Cases * **Telecommunications:** Used on high-speed networking chips. * **Computing:** Cooling for voltage regulator modules (VRMs) or chipsets. * **Industrial:** Protection for power-sensitive components in harsh environments.