The **ATS-13B-19-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs) and other surface-mount components. --- ## Technical Specifications The following table outlines the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height (Off Base)** | 15.00mm | | **Thermal Resistance (Flow)** | 9.77°C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.10°C/W | --- ## Key Components and Features ### 1. Thermal Interface Material (TIM) This part comes pre-applied with **T766**, a high-quality thermal phase-change material. This ensures optimal heat transfer between the electronic chip (CPU/GPU/FPGA) and the aluminum heat sink base. ### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism. * **Vibration Resistance:** Securely holds the heat sink in place even in high-vibration environments. * **Uniform Pressure:** Ensures consistent contact pressure across the component surface for maximum cooling efficiency. ### 3. Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** pattern (depending on the specific revision), optimized for airflow from multiple directions. The 15mm height is considered "low profile," making it suitable for compact electronic enclosures or 1U/2U rack servers. ### 4. Material and Finish The **Blue Anodized aluminum** serves two purposes: * **Enhanced Radiation:** The anodized layer slightly improves heat radiation. * **Corrosion Protection:** It protects the aluminum from oxidation in various operating environments. --- ## Application and Use Cases The ATS-13B-19-C2-R0 is typically used for: * **Networking Hardware:** Switches, routers, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** High-density power conversion modules that require active or passive cooling.