The **ATS-13B-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is part of the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | Cross-Cut (Pin Fin) | | **Dimensions** | 45.00mm x 45.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 100 LFM) | | **Finish** | Blue Anodized | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Part Number Breakdown The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS-13**: Refers to the specific series/style of the heatsink. - **B**: Indicates the specific revision or mechanical variation. - **20**: Generally relates to the height or fin density configuration. - **C2**: This code represents the thermal performance/material grade. - **R0**: Indicates the finish (Blue Anodized) and the inclusion of a specific Thermal Interface Material (TIM). --- ### 3. Key Features & Benefits - **Cross-Cut Fin Design:** The "Pin Fin" or cross-cut pattern allows for air to enter from any direction, making it ideal for systems where airflow direction is inconsistent or crowded. - **PushPIN™ Attachment:** It uses a spring-loaded mechanism that provides consistent pressure to the component, ensuring optimal thermal contact while preventing damage from over-tightening. - **Pre-applied TIM:** It comes with a high-performance thermal pad (T766) already attached to the base, which simplifies the assembly process in a manufacturing environment. - **High Aspect Ratio:** The aluminum construction offers a lightweight yet effective solution for heat dissipation in power-sensitive electronics. --- ### 4. Typical Applications This heatsink is commonly used in environments where space is limited but cooling demands are high, such as: 1. **Network Switches & Routers:** Cooling CPUs and ASICs. 2. **Industrial PC Boards:** Protecting processors from overheating in harsh environments. 3. **Power Supplies:** Managing heat for MOSFETs or high-speed regulators.