The **ATS-13B-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 6.00mm | | **Thermal Resistance (Flow)** | 6.39°C/W @ 100 LFM | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Key Component Features #### A. XCUT Fin Design Unlike straight-fin heat sinks, the XCUT design features cross-cut patterns. This allows for **omni-directional airflow**, meaning the heat sink can dissipate heat effectively regardless of the direction the cooling fan is blowing. #### B. Material and Coating * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases surface emissivity, slightly improving radiation heat transfer, and protects the aluminum from corrosion. #### C. Push-Pin Attachment The "C2" in the part number indicates the attachment hardware. This model uses **Brass Push-Pins** with steel springs. This system provides: * Consistent pressure (preload) for better thermal interface contact. * Quick installation through pre-drilled holes in the PCB. --- ### 3. Thermal Performance Profile Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.39 | | 300 (1.5 m/s) | 2.85 | | 500 (2.5 m/s) | 2.07 | --- ### 4. Implementation Requirements To use this part in an electronic design, the following are required: 1. **PCB Hole Pattern:** Two holes must be drilled into the PCB to accommodate the push-pins. 2. **Thermal Interface Material (TIM):** A thermal pad or grease must be applied between the base of the heat sink and the electronic component (CPU, GPU, or FPGA) to eliminate air gaps.