The **ATS-13B-28-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, commonly used to dissipate heat from integrated circuits like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 15.00mm | | **Thermal Resistance** | 10.57°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Square-Cut (Cross-cut) | --- ## 2. Key Design Features ### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this part uses a **pushPIN™** mechanism. - It consists of a plastic or brass pin with a stainless steel spring. - It provides precise mounting pressure (preload) to optimize the thermal interface material (TIM) performance. - It requires pre-drilled holes in the PCB. ### B. Fin Geometry: Square-Cut The "Square-Cut" or cross-cut fin design allows for **multi-directional airflow**. - In many electronic enclosures, airflow direction can be unpredictable. - This fin style ensures that heat is dissipated efficiently regardless of whether the air moves horizontally or vertically across the component. ### C. Material and Coating - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodized Finish:** Not only provides a professional aesthetic but also increases the surface emissivity and protects the aluminum from corrosion. --- ## 3. Thermal Performance Profile Thermal resistance is critical for determining if this heatsink can keep a chip within its operating temperature. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.57 | | 300 (1.5 m/s) | 4.47 | | 500 (2.5 m/s) | 2.96 | | 700 (3.5 m/s) | 2.30 | --- ## 4. Typical Applications * **Embedded Systems:** For cooling SoCs in industrial computers. * **Telecommunications:** Cooling signal processing chips in routers and switches. * **Power Electronics:** Dissipating heat from high-speed voltage regulators.